Task 4.2: Less material in product to reduce e-waste

Objective:

Within this task, EECONE partners strive for significant reduction of material usage to avoid e-waste in terms of components and material on different design levels by the development of innovative components & material-saving technologies to be adopted into future products. Positive effects in comparison to state-of-the-art will be proven through advanced technology-demonstrators and use- case demonstrators for a variety of different application fields, like automotive, medical/health/well- being, aeronautic, to name a few. The EECONE use cases, together with the planned demonstrators, will pave the way toward exploitation into relevant future products with high need for e-waste reduction and are listed in Task 4.1, where also the Task 4.2-developments will provide significant contributions. The addressed design levels driven here in Task 4.2 for e-waste reduction include both component level and system level activities:
Components level
System levelDescription:The most effective way to reduce the amount of e-waste is to use less components and less material for a system with the same functionality. Therefore, the reduction of used components and material is a key factor for reduction of e-waste. The work in Task 4.2 will have a special focus on technologies for high volume productions and/or disposable systems (disposability inevitable due to e.g. hygienic issues), as for such use-cases the impact of e-waste reduction is most significant and therefore of high relevance.In Task 4.2, EECONE partners work together along value chains. The technology developments and technology advancements of the partners respectively group of partners as described below (see Role of partners), will be selectively co integrated and combined with activities from other tasks to form relevant supply chains for use-case demonstrators, which are described in UC-1, 2,3, 6 and 9.

Task Leader : ORBX
Involved Partners : ACO, AT&S, BOSCH_PT, CSEM, DTI, FhG-ISC, HTV, IFAG, IFAT, IFEVS, IMA, LDO, LGE, MelsenTech, ORBX, PRELONIC, PREMO, SAL, SOITEC, SOITEC, Synano, THD, UNIPG, Vitesco
Involved Partners >>