Task 4.3: Second life to electronics

Objective:

T4.3 will reduce the environmental impact of existing (PCB) and new generation of electronics, as determined by WP3, by standardising a second life for electronics, thus postponing recycling at end- of-life while ensuring reliability.
Description:
Prolonged lifetime will be achieved by focusing on smarter modular designs, dedicated software improvements and hardware-related efforts intended to repair, re-use and refurbish existing and the new generation of electronics. Activities on hardware for second life includes circuitry repair, component hybridization and processing module characterization and determination of reliability on re-use. Software-based strategies to include the extension of the lifetime of refurbished components will be implemented and the quantification of reuse benefits. Limitations and opportunities from WP2 recycling efforts will be used to further steer T4.3 activities. All sustainable developments in Task 4.3 will converge in EECONE use-cases, resulting in a cumulative impact that will extend lifetime by at least 50%. Detailed analyses of hardware components and devices before and after will provide key arguments to WP5 to promote an industry wide adoption of a second-life program on EECONE advances.
All material fields can contribute to reduction of e-waste for the products such as Electrical control units (ECUs) in the automotive domain. Between them, PCB substrates, the components, and their interconnections play an important role. That is the reason why in this contribution we evaluate the reuse/repair process with the focus on interaction between AITs, connectors, PCBs, and components in ECU-Level.

Task Leader : ORBX
Involved Partners : ACO,ANIAH,ECODC,HTV, HUA, IFAT, INP-GRE, Leonardo, PREMO, RISE, SAL, SVS, THALES DIS, UCLouvain, Vitesco
Involved Partners >>