Sub task 2.3.2 Material and combination of material constraints

In actual E waste some combinations of materials or materials are difficult, even impossible, to recycle in an economic way. Those combinations will be listed after discussion and interviews with the different steps of recycling needed to recover and refine raw materials.

Those different constraints will be aggregate in the deliverable:

- Construction and material constraints

Role of partners:

 SPHEREA will work on identifying constraints related to reuse and reparability of electronics systems like components.

 WEEECycling will work on identifying constraints related to the recyclability of metals. Many alloys are complicated to recycle due to the presence of one specific element like nickel for example. We will work to identify all those constraints.

 DTI will work on Battery constraints related to reuse, reparability and recyclability

 VITESCO will provide use case data on construction constraints and element to be improved in the design of next generation for such components

 PREMO will work on raw material (plastics, metals, ferrites) constraints related to recycling

 Nerosubianco: participate to the analysis of recycling supply chain + assess WP2 related Use Cases

 Swiss Vault will utilize the data points and frameworks emerging from construction materials for recyclability analysis, and apply it to design data server racks (see Use Case 7). The aim will be to enhance recyclability or repurposing of data servers with intent to achieve zero waste at end of life.

 STGNB 2 SAS & ST-I: Case study on IC package design innovation to support eco efficient system design following different paths of improvement such as: reducing number of components through System in Package (SiP) for heterogenous integration of "standard" functional blocks (system size reduction), breakthrough PCB technologies with reduced layers count or fully recyclable materials. Specific contribution:

1. Brainstorm and packaging expertise with system design partners

2. Prototype designs

3. Prototypes fabrication using ST assembly prototyping line

STGNB 2 SAS will link this task with WP3 by providing support for the database structure, metrics definition and eco-design guidelines.

 IFAG will investigate innovative IC package designs to support eco-efficient system design.