Subtask 3.1.1: Eco-design platform
This first sub-task will provide the platform infrastructure to support the eco-design of products from chips to PCB to system level, and the collaboration between all stakeholders. The partners involved will also manage interoperability between tools to cover the targeted processes and data exchange. The deliverable D3.1 at month M0+11 will provide the specification for the infrastructure and the databases that will be used for the implementation phase and also as an input for Task 3.2 and Task 3.3. The deliverable D3.2 will report the progress of the implementation of the infrastructure framework and the databases at M22. Finally the final report (D3.3) will be provided at M36.Leader : 3DS
Involved Partners : 4MOD, Aniah, ARCELIK, FHG, HUA, IFAG, NSB, PREMO, RISE, SSOL, UL-IMF, WEEECYCLING