Subtask 4.1.2: Development and manufacturing of low environmental impact materials

- SYNANO will develop and manufacture carbon based conductive inks by using sustainable materials to fulfil functional and performance requirements from UC-3, 4 and 6 based on inputs provided by partners. Optimization processes will be conducted to achieve compatibility with substrates, printing processes and end user requirements. Properties of the developed ink such as electrical conductivity, viscosity etc. will also be checked.
- DTI will develop metallic conductive inks (especially with Copper Nanoparticles) to be printed on substrates selected for UC-1, 3, 4, 6 and 10. They will also carry out up-scaling of the production process for the inks.
- AT&S will research the state of the art in low environmental impact materials and related improvement potential for low environmental impact substrates. Based on the technological material assessment with regard to use case specific requirements PCB/substrate concepts will be setup and respective technology demonstrators will be built and tested. The LCA Tool generated in WP3 will be used to rate the environmental impact of the provided solutions. AT&S will support UC-1 and UC-2.
- IFAG and THD will collaborate to investigate new package material that can be recycled. Test vehicles for evaluation of the new material will be set-up. evaluated for their use in packaging processes and devices e.g. new mold compound material.