Subtask 4.1.4: Testing and integration into technology demonstrators

• CEA will benchmark novel inks and substrates provided by the consortium partners and/or commercially available, for electronic circuits printing and pick and place of Si-based components. They will also carry out electrical characterization and support 4MOD activities to integrate the manufactured electronics (PCB/Antenna) into remote control units (UC-4).
  
• 4MOD will test antenna s performance (S parameters, radiation pattern, range etc.) and PCB s performances (system voltages, MCU s programming, absence of short-circuits etc.) developed using organic substrates / conductive inks. They will integrate manufactured electronics (PCB/Antenna) into remote control units (UC-4) and test using 4MOD test protocol (Detection of key presses, infrared emission, RF connection, BLE pairing etc.).
  
• AT&S will investigate and test the suitability of the new low environmental impact PCB and substrate concepts for PCB developed in subtask 4.1.2 for production for UC-1 and UC-2.
  
• DTI and Melsentech will test pilot scale production for UC-3.
  
• ACO will assess the possibility to integrate and use new materials developed by the partners for the PCBs (substrates, inks, lead free soldering) and greener components for the development of a modular green IoT platform for the agriculture use case (UC-10).
  
• Vitesco will bring a use case representative of Power electronics within the Automotive industry with the requirements and evaluate the qualification of the solutions for such applications being given our requirements. This evaluation will be based on simulation evaluation by receiving the material characteristics from sub-tasks 4.1.2/4.1.3.
  
• UNIPG will provide circuit design of integrated prototypes and demonstrators of IoT sensors according to the selected use cases (UC-10-9), allowing a significant reduction of environmental impact in comparison with conventional manufacturing and materials.
  
• LGE will provide manufacturing and tests of the same IoT sensors prototypes and demonstrators (UC- 10-9).
  
• CSEM will develop a sustainability-optimised remote sensing node based on new design approaches combining re-usability and use of green materials. The electronics will be implemented to be easily detached from node infrastructure and repurposed. The node will be wirelessly supplied to avoid use of batteries. The electronics will be adapted to the performances and specifics of new green materials from the project. When performances will not match minimal requirements, less sustainable materials will be regrouped in the re-usable part. In addition, CSEM will perform study on biodegradability vs RF performance and explore the possibilities and methods of the interconnect between BIO inks and IC. During the project execution, CSEM will closely cooperate with SAL (UC-6) and CEA.
• FHG-IZM: The targeted approaches in the use cases will be accompanied by reliability analyses at component and material level (such as thinner PCBs with less copper in the inner layers).
• IFAG will work on testing and integration in technology demonstrators, as well as on the development and investigation of test setups.