Subtask 4.3.1 Modularity of PCB and new generation of electronics

• System design architecture and modular design for:
- Soil probe for agriculture as an IoT use-case (UTIA, TST)
- High Voltage Box use-case, e.g. integrated combination of an AC On Board Charger and a Low Voltage DCDC (INP-Gre, Vitesco)
- SW/HW design methodology for module-PCB to carrier-PCB with minimal negative impact on reliability of the system in its second life (UTIA)

• Testing of reliability of re-usable module-based systems (UTIA)


• Development of Modular PCB and substrate concepts and related designs and build-ups for resource and use optimization, featuring health indicators allowing assessment of board health condition about refurbish or second life. (AT&S, INP-GRe)
• IFAG will work on modularity of PCBs and new generation electronics.

Subtask 4.3.1 will be reported in deliverable D4.6