Subtask 4.3.3 Component analysis and refurbishing

• Component-directed re-use/refurbishing/Recycling approaches:
-Process development of STM rework including layout (Bosch)
- Developmentofstrategiesforrecyclingofexistingandnewcomponentsforautomotive electronics (Bosch/IZM) definition of component reliability for re-use (Infineon, Bosch, HTV)
- Component release methodologies (Infineon, Bosch, PREMO)
- PCB/SiP test and validation for re-use (IZM, Bosch HTV)
- Definitionofthesystemrobustnessincaseofre-useincomparingtothefirstuse(IZM, Bosch)
- Hybridization of single-use sensor patch and multi-use, multi-modal chip patch (SAL, IFAT, HTV)

• Second-life of microprocessor:
- Developmentandevaluationofsystemdesignmethodologysupportingreuseofcentral modules (with STM32 MCUs) with program flash and data memory in the device on PCB and new generation EECONE carrier boards (UTIA)
- Repurposing of microprocessors in data centre scenarios (RISE) with support from ECODC. With an ageing Moore’s law there is now a strong impetus to reuse microprocessors in data centre servers and this will feed into UC-7 for moving older equipment to support less critical digital services.

• Quantification of environmental benefits
  
- LCA assessment considering the load and load ability of system after first pin plastic/elastic deformation as well as plated through hole (PTH) vias touch in PCB (IZM, Bosch)

Subtask 4.3.3 will be reported in deliverable D4.5